Standard layer connection
Best for common multilayer designs where holes pass through the full board.
Via Comparison
Through hole vs blind via vs buried via.
Different via structures support different routing and stackup needs. Manufacturing review should confirm feasibility before production planning.
Outer-to-inner connection
Useful for dense layouts but requires stackup and drilling review.
Internal connection
Supports advanced routing density but adds process complexity and inspection planning.
| Engineering item | Manufacturing review | Related page |
|---|---|---|
| Files | Gerber, drill, outline, stackup and manufacturing notes. | Required files |
| Capability | Layer count, board thickness, copper, material and surface finish. | Capabilities |
| Quality | AOI, electrical testing, visual inspection and reliability review. | Quality Control |
Related engineering resources
Prepare your PCB project for engineering review.
Send manufacturing files, stackup details, material requirements and application notes.