Layer planning
Define signal, plane and power layers with board thickness and material requirements.
Stackup Design
PCB stackup design guide for manufacturing review.
A clear PCB stackup helps align routing, impedance, drilling, material selection and board thickness before production.
Controlled impedance
Trace geometry, dielectric thickness and copper weight should be coordinated with target impedance.
Fabrication review
Stackup notes should match Gerber files, drill data and inspection expectations.
| Engineering item | Manufacturing review | Related page |
|---|---|---|
| Files | Gerber, drill, outline, stackup and manufacturing notes. | Required files |
| Capability | Layer count, board thickness, copper, material and surface finish. | Capabilities |
| Quality | AOI, electrical testing, visual inspection and reliability review. | Quality Control |
Signal integrity and power planes
Signal layers
Signal layers should be arranged with clear reference planes when controlled impedance or high speed routing is required.
Power planes
Power and ground planes support stable return paths, lower noise and cleaner routing in multilayer PCB designs.
Material selection
Dielectric thickness, resin system, Tg and copper weight should be confirmed before manufacturing release.
Stackup FAQ
What PCB layer counts can you manufacture?
YBCPCB reviews 2-32 layer PCB projects based on stackup, material, thickness and drilling requirements.
What files are required for PCB manufacturing?
Gerber files, drill files, board outline, stackup notes, material requirements, surface finish, copper weight and inspection notes are recommended.
Do you support prototype and mass production?
Yes. Stackup review supports prototypes, small batches and mass production preparation.
Related engineering resources
Prepare your PCB project for engineering review.
Send manufacturing files, stackup details, material requirements and application notes.