Material Guide
PCB material guide for FR4, High Tg, aluminum and flexible PCB.
Material selection affects thermal reliability, mechanical strength, dielectric behavior, assembly compatibility and long-term PCB performance.
FR4 and High Tg materials
FR4 supports many rigid PCB applications. High Tg material is considered when the product faces higher assembly temperatures, operating temperatures or reliability requirements.
Aluminum and flexible materials
Metal Core materials support thermal management for LED and power products. Flexible materials are used when the circuit must bend, fold or fit compact mechanical spaces.
Material review
Material choice should match stackup, board thickness, copper and application environment.
| Material | Typical use | Engineering note |
|---|---|---|
| FR-4 | General rigid PCB manufacturing | Common for control boards and electronics modules. |
| High Tg FR-4 | Higher thermal reliability needs | Review assembly and operating temperature. |
| Halogen Free | Compliance-focused projects | Confirm customer and market requirements. |
| Metal Core | Thermal management | Used for LED and power electronics. |
| Flexible materials | Flexible PCB and rigid-flex PCB | Review bend radius, coverlay and stiffener needs. |
PCB material FAQ
What materials are available?
FR-4, High Tg FR-4, Halogen Free, Metal Core and flexible materials can be reviewed by project requirements.
When should High Tg material be selected?
High Tg material is considered for higher thermal stress, lead-free assembly or demanding operating environments.
What files are required for PCB manufacturing?
Gerber files, drill files, stackup notes, material requirements, surface finish and inspection notes are recommended.
Review PCB material requirements with engineering.
Send material notes, application environment and manufacturing files.