Manufacturing Process
PCB manufacturing process from engineering review to final testing.
This guide explains the major fabrication steps buyers should understand when preparing files for multilayer PCB, HDI PCB and prototype PCB production.
PCB manufacturing workflow
The process begins with CAM review, file checking and material confirmation. After engineering approval, production moves through inner layer imaging, etching, lamination, drilling, plating, outer layer imaging, solder mask, surface finishing and final profiling.
Inner layer process and lamination
For multilayer PCB, inner layer copper patterns are prepared before layup. Lamination bonds cores, prepreg and copper foils into a stable structure that must match the approved stackup.
Process control
Each process stage should match material, layer count and quality requirements.
| Process stage | Purpose | Buyer note |
|---|---|---|
| Drilling | Creates plated and non-plated holes | Drill files should match the Gerber package. |
| Plating | Builds conductive hole walls and copper thickness | Review copper weight and hole requirements. |
| Imaging | Transfers circuit patterns to copper | Trace width and spacing must match capability. |
| AOI inspection | Checks pattern defects before later process steps | Important for multilayer and fine line boards. |
| Testing | Verifies electrical continuity and isolation | Testing requirements should be confirmed early. |
Prepare files for manufacturing review.
Send design files, stackup notes and application requirements.