Layer and stackup review
Multilayer and HDI projects should include stackup notes, impedance needs and drill structure details.
Manufacturing Capability
PCB manufacturing capability for technical buyer review.
Use this capability overview to prepare layer count, material, board thickness, copper thickness, surface finish and testing requirements before contacting engineering.
| Capability item | Review range | Engineering note |
|---|---|---|
| Layer count | 2-32 layers by review | Confirm stackup, drilling and board thickness. |
| Material | FR-4, High Tg, Halogen Free, Metal Core, flexible materials | Select by thermal, mechanical and compliance requirements. |
| Board thickness | 0.4mm-3.5mm by structure review | Connector fit, rigidity and assembly process matter. |
| Copper thickness | 1oz-6oz by application review | High copper requires spacing and plating review. |
| Surface finish | HASL, Lead Free HASL, ENIG, OSP, Immersion Silver | Match finish with assembly and storage requirements. |
| Testing capability | AOI, electrical testing, visual inspection | Testing plan follows board type and application. |
Detailed Capability Table
PCB manufacturing parameters for technical review.
The table below gives buyers a clear structure for preparing PCB requirements before engineering review.
| Category | Capability | Details |
|---|---|---|
| Layer | 2-32 Layers | Includes 2 layer PCB, 4 layer PCB, multilayer PCB and advanced stackups by review. |
| Material | FR4, High Tg, Halogen Free, Metal Core | Material selection depends on thermal, electrical, mechanical and compliance requirements. |
| Board Thickness | 0.4mm-3.5mm | Thickness should match connectors, mechanical strength and assembly process. |
| Copper Thickness | 1oz-6oz | Higher copper requires trace spacing, plating and thermal review. |
| Surface Finish | HASL, Lead Free HASL, ENIG, OSP, Immersion Silver | Finish should match pad geometry, assembly method and storage requirements. |
| Testing | AOI, Flying Probe, Electrical Testing | Testing method is selected by board type, production stage and customer requirements. |
Material and finish review
Material and finish should match product environment, assembly process and reliability expectations.
Testing review
Electrical testing, AOI and visual inspection expectations can be confirmed before production planning.
Review your PCB manufacturing requirements.
Send files, stackup notes, material requirements and quality expectations.