Stackup Resource
PCB layer stack guide for multilayer manufacturing.
Layer stack planning affects routing density, board thickness, impedance, grounding and lamination review.
Layer stack basics
A PCB stackup defines copper layers, dielectric materials and board thickness. Multilayer PCB projects should include stackup information whenever impedance, fine pitch routing or controlled thickness is important.
Engineering considerations
- Use layer pairs and plane layers to organize routing and grounding.
- State target thickness and material requirements early.
- Include impedance requirements with trace geometry when available.
| Layer type | Purpose | Related process |
|---|---|---|
| Signal layer | Routing and component connection | Imaging and etching |
| Plane layer | Ground and power structure | Lamination review |
| Dielectric layer | Insulation and thickness control | Material selection |
Review a PCB stackup.
Send stackup drawings and manufacturing files to engineering.